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Processing System Product List

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Laser processing system microFLEX(TM) series

State-of-the-art modular roll-to-roll laser processing system that completes all R2R processes such as cleaning, coating, and laser scribing.

The microFLEX(TM) series laser processing system has been developed for processing flexible materials such as resin and paper in a roll-to-roll manner. The standout feature of the microFLEX is its modular concept, allowing for free modification and scaling of the processing steps for flexible substrates, making it a truly "Flexible" device. It can encompass all necessary processing steps for roll-to-roll applications, including cleaning, coating, printing, laser scribing, lamination, and cutting. The processes before and after laser micromachining can also be integrated into the device. This product supports applications from research and development to production for organic solar cells, OLEDs, RFID antennas, printed batteries, and more. 【Features】 ○ High-speed, continuous, large-area processing with lasers ○ Modularization of each process in roll-to-roll technology ○ Easy process changes with module replacement ○ Reduction of production costs ○ Support from R&D to mass production For more details, please contact us or refer to the catalog.

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Laser Microfabrication System microSTRUCT Series

The system can accommodate up to two lasers, achieving optimal micromachining. It is suitable for a wide range of applications from research and development to production!

The laser microprocessing system microSTRUCT vario(TM) can be equipped with three beam lines. You can choose from various laser light sources optimal for applications, including ps lasers, femtosecond lasers, and fiber lasers. Whether the processing materials are diverse such as resins, ceramics, or metals, and regardless of whether multiple processes like cutting, drilling, or patterning are required, this device, microSTRUCT vario, can handle the job with just one unit. If the processing sequence is consistent, you can also use the microSTRUCT compact with a single beam line. 【Features】 ○ Fine hole processing → Capable of forward taper and reverse taper processing ○ Fine cutting ○ Fine engraving and internal marking ○ 2D and 3D patterning For more details, please contact us or refer to the catalog.

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